Customization: | Available |
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Model No.: | 3X3mm |
Application: | Corrosion-Resistant Materials |
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Features
In terms of tin particles, which are crucial in electronic manufacturing and alloy production, they boast numerous outstanding features that make them indispensable in a wide range of industrial applications. Firstly, their excellent conductivity ensures the stability and efficiency of circuits in electronic products, making them a core component in soldering. Secondly, tin particles have a relatively low melting point of around 232°C, allowing them to melt at lower temperatures, which facilitates processing and application, particularly in the soldering of electronic components. Furthermore, tin exhibits superior corrosion resistance, effectively protecting metal surfaces from oxidation and corrosion, thereby extending the service life of products. In addition, tin particles are available in various forms, such as powder, spheres, or flakes, to accommodate diverse industrial requirements. Lastly, the environmental friendliness of tin should not be overlooked, as the development and use of lead-free solders have reduced the use of hazardous substances, aligning with the trend towards green manufacturing.
Sales are going fast Tin Pellets 99.99% Metal Tin Sn Granules Evaporation Materials for PVD Coating
Name | tin(Sn) granules | |||||||
Purity | 99.9%-99.9999% | |||||||
Size | 30-50mm 1-3mm 2-6mm 1-6mm | |||||||
Boiling Point |
2270 |
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Density | 7.3 g/cm³ | |||||||
Melting Point |
231.96 |
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Shape | corrosion-resistant materials | |||||||
MOQ | 1KG | |||||||
Application | Catalysis field Biomedical field Energy field |
Product features
Our tin granules, pivotal in the electronics sector, embody exceptional characteristics: they exhibit high purity, crucial for maintaining stability and reliability in soldering operations; feature uniform particle size, facilitating the seamless operation of automated soldering machinery and boosting production efficiency; possess a thin surface oxide layer, significantly minimizing the formation of solder slag and thereby reducing production costs; have a moderate melting point, accommodating a wide range of soldering temperature requirements for enhanced application versatility; and come in precision packaging, safeguarding against contamination and moisture during transit to ensure product integrity for extended storage.
Application
2.Alloy Manufacturing: Tin can form alloys with other metals such as copper, lead, and bismuth, used in the production of bearing alloys and fusible alloys. These alloys, with good wear resistance and melting point properties, are widely used in machinery manufacturing and precision instruments.
3.Anti-corrosion: Tin has strong corrosion resistance, so tin granules can be used for tin plating on metal surfaces to prevent rust. For example, tin cans in food packaging utilize this property of tin.
Storage conditions